Probe card for examining semiconductor devices on semiconductor wafers

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 7081766
APP PUB NO 20040257098A1
SERIAL NO

10870017

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Probe card for examining semiconductor devices on semiconductor wafers that allows the members configuring the probe card to be easily separated and assembled, prevents the occurrence of electrical conduction failure between electrodes and achieves high electrical contact and high reliability. The probe card is used for measuring electrical properties of a measuring object and includes a space transformer including a plurality of contacts contacting an electrode pad of the measuring object on one surface and a plurality of connecting pins on a surface opposite the surface with the contact, a main substrate including a plurality of first connecting electrodes contacting an electrode pad of measuring equipment, and a sub-substrate including a plurality of through-holes, through which the connecting pin is inserted between the main substrate and the space transformer, for electrically conducting with the first connecting electrode, where the sub-substrate and the main substrate are coupled together.

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Patent Owner(s)

Patent OwnerAddress
JAPAN ELECTRONIC MATERIALS CORPJAPAN HYOGO PREFECTURE HYOGO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Mori, Chikaomi Hyogo, JP 16 76
Nakashima, Masanari Hyogo, JP 3 15
Satou, Katsuhiko Hyogo, JP 4 56

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