Method, system and medium for process control for the matching of tools, chambers and/or other semiconductor-related entities
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United States of America Patent
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Jul 25, 2006
Grant Date -
Dec 26, 2002
app pub date -
Jun 18, 2002
filing date -
Jun 19, 2001
priority date (Note) -
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status (Latency Note)
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Abstract
The invention relates to a method, system and computer program useful for producing a product, such as a microelectronic device, for example in an assembly line, where the production facility includes parallel production of assembly lines of products on identically configured chambers, tools and/or modules. Control is provided between such chambers. Behaviors of a batch of wafers (or of each wafer) are collected as the first batch (or each wafer) is processed by one of the identically configured chambers in one assembly line to produce the microelectronic device. The information relating to the behavior is shared with a controller of another one (or more) of the identically configured chambers, process tools and/or modules, to provide an adjustment of the process tool and thereby to produce a second batch (or next wafer) which is substantially identical, within tolerance, to the first batch (or wafer).
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