Contact structures and methods for making same
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United States of America Patent
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Aug 1, 2006
Issued Date -
N/A
app pub date -
Sep 10, 2004
filing date -
Nov 16, 1993
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Contact structures are formed by building a core structure on a substrate and over coating the core structure with a material that is harder or has a greater yield strength than the material of the core structure. The core structure may be formed by attaching a wire to the substrate and spooling the wire out from a spool. While spooling the wire out, the spool may be moved to impart a desired shape to the wire. The wire is severed from the spool and over coated. As an alternative, the wire is not over coated. The substrate may be an electronic device, such as a semiconductor die.
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