Intermetallic spring structure
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United States of America Patent
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Aug 1, 2006
Grant Date -
Feb 9, 2006
app pub date -
Aug 4, 2004
filing date -
Aug 4, 2004
priority date (Note) -
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status (Latency Note)
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Abstract
A spring structure in which the transition of a metal layer from a solid solution to an intermetallic compound is utilized either to bend a spring finger into a curved shape, or to increase the yield point of the spring finger. The spring finger has an anchor portion attached to a substrate, and a cantilever portion extending over the substrate surface. The metal layer forms at least a portion of the spring finger. The metal layer is initially formed as a solid solution including a primary and secondary elements that transform to an intermetallic compound upon annealing, thereby generating a bending force that causes the cantilever portion of the spring finger to bend relative to the substrate, and/or to increase the yield point of the bent cantilever portion. The metal layer is formed by plating and/or sputtering, and annealing is performed before and/or after release of the cantilever portion.
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