System for lead retention and sealing of an implantable medical device
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United States of America Patent
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-
Aug 1, 2006
Grant Date -
N/A
app pub date -
Dec 8, 2004
filing date -
Dec 8, 2004
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A connector assembly for coupling an electrical lead to an electrically energized device includes a non-conductive housing member with an elongated bore. A block member in the bore proximate the sealed end has a coaxial through bore. A first of multiple side by side pairs of seal assemblies and contact assemblies in the bore is proximate the block member, a last one is nearest the bore entrance. Each contact assembly has electrical commonality with a terminal of the device. A strain relief zone fixed to the housing member in the bore engages the last seal assembly and faces the bore entrance. Force on the strain relief zone toward the block member firmly seals in the bore all components defining a central passage coaxial with the through bore enabling electrical contact among multiple lead terminals inserted into the bore, an associated contact assembly, and an associated terminal of the device.
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