Programmed material consolidation processes for protecting intermediate conductive structures
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United States of America Patent
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Aug 1, 2006
Issued Date -
N/A
app pub date -
Aug 31, 2004
filing date -
Jun 8, 2000
priority date (Note) -
Expired
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Abstract
A method for protecting intermediate conductive elements, such as bond wires, of semiconductor device assemblies includes selectively altering a state of substantially unconsolidated material adjacent to an intermediate conductive element. Selective alteration of the state of the substantially unconsolidated material may be effected by way of a programmed material consolidation process, such as stereolithography. Programmed material consolidation may be accompanied by a feature-recognition technique, such as machine vision. When a programmed material consolidation process is effected, a plurality of adjacent, mutually adhered regions, such as layers, of a protective structure may be formed.
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