Leads under chip IC package
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United States of America Patent
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Aug 1, 2006
Issued Date -
N/A
app pub date -
Jul 20, 2005
filing date -
Dec 30, 1996
priority date (Note) -
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Abstract
A semiconductor device assembly including a semiconductor device having a plurality of bond pads on the active surface thereof and a lead frame having a portion of the plurality of lead fingers of the lead frame located below the semiconductor device in a substantially horizontal plane and another portion of the plurality of lead fingers of the lead frame located substantially in the same horizontal plane as the active surface of the semiconductor device. Both pluralities of lead fingers of the lead frame having their ends being located substantially adjacent the peripheral sides of the semiconductor device, rather than at the ends thereof.
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