Method for packaging a multi-chip module of a semiconductor device
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Aug 8, 2006
Grant Date -
Aug 12, 2004
app pub date -
Dec 30, 2003
filing date -
Dec 30, 2002
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method for packaging a multi-chip module is carried out by connecting a first chip having thereon wafer bumps to lower parts of inner leads of TAB tapes having the inner lead and an outer lead, thereby electrical signals being communicated therebetween; connecting a second chip having thereon wafer bumps to an upper part of the TAB tapes connected to the first chip, thereby electrical signals being communicated therebetween; and executing an encapsulation step, wherein an underfill material is filled in a connecting portion between the TAB tapes and the chips.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully