Methods for protecting intermediate conductive elements of semiconductor device assemblies
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United States of America Patent
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Aug 8, 2006
Issued Date -
N/A
app pub date -
Aug 12, 2004
filing date -
Jun 8, 2000
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method for protecting intermediate conductive elements, such as bond wires, of semiconductor device assemblies, includes sequentially fabricating one or more material layers of one or more protective structures to be associated with the intermediate conductive elements. After a first layer is formed, each subsequent layer is superimposed upon, contiguous with, and mutually adhered to an underlying layer of the protective structure.
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