Semiconductor packaging apparatus
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United States of America Patent
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Aug 8, 2006
Grant Date -
Feb 5, 2004
app pub date -
Jul 30, 2002
filing date -
Jul 30, 2002
priority date (Note) -
Expired
status (Latency Note)
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Abstract
An exemplary embodiment of the present invention described and shown in the specification and drawings is a semiconductor packaging apparatus that includes a first substrate for coupling to an electronic component, and a second substrate for accommodating the electronic component coupled to the first substrate.
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