Method of manufacturing flip chip resistor
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United States of America Patent
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Aug 15, 2006
Grant Date -
Mar 4, 2004
app pub date -
May 19, 2003
filing date -
Sep 3, 2002
priority date (Note) -
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Abstract
The present invention provides for a method for manufacturing flip chip resistors by applying a first electrode layer to a substrate to create at least one pair of opposite electrodes, applying a resistance layer between each pair of opposite electrodes, applying a first protective layer at least partially overlaying the resistance layer, applying a second protective layer at least partially overlaying at least a portion of the resistance layer, and applying a second electrode layer overlaying the first electrode layer, a portion of the resistance layer, and at least a portion of the second protective layer. The present invention provides for higher reliability performance and enlarging the potential soldering area despite small chip size.
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