Method for packaging small size memory cards
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Aug 15, 2006
Grant Date -
Oct 14, 2004
app pub date -
Apr 11, 2003
filing date -
Apr 11, 2003
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method is disclosed for packaging a small size memory card, including xD Picture card, Memory Stick.TM., Secure Digital.TM. (SD) card, SmartMedia.TM. (SM) card, Multimedia card (MMC), CompactFlash.TM. (CF) card and PC card, by moulding over to encapsulate a populated printed circuit board (PCB) (10) to form the standard external dimensions and features of the memory card.The method comprises holding the populated PCB (10) in place in a cavity (44) of at least one mould piece; and moulding over both sides of the populated printed circuit board (10) to encapsulate said board. Various embodiments are disclosed, including means for holding the populated PCB (10) in the moulding cavity (44) for the encapsulation process, which includes transfer moulding and injection moulding processes, one or more moulding steps, and moulding over one part of one side of said board before the other side, and/or simultaneously moulding over both sides of said board.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully