US Patent No: 7,090,920
Number of patents in Portfolio can not be more than 2000
Poly(arylene ether) adhesive compositions
Stats
-
Aug 15, 2006
Issued date -
Jan 7, 2005
filing date -
11/031,399
serial no -
In Force
status
Importance
Loading Importance Indicators...
Abstract
A laminate, comprises a thermoplastic substrate, a conductive metal foil at least partially disposed on at least one side of the substrate, and an adhesive disposed between the substrate and the metal foil. The adhesive includes a blend of a poly(arylene ether), a thermosetting resin, a toughening agent, a plasticizer, and a cure agent. The laminate finds particular utility in circuit board applications.
Loading the Abstract Image...
First Claim
Related Publications
Loading Related Publications...
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art
| Patent Info | (Count) | # Cites | Year |
|---|---|---|---|
|
|
|||
| 4,196,116 Impact resistant polyphenylene ether compositions containing EPDM rubber-modified alkenyl aromatic resins and hydrogenated diblock copolymers | 17 | 1977 | |
| 4,477,649 Two-stage continuous process for preparation of polyphenylene oxides | 18 | 1983 | |
| 4,477,651 Process for preparing polyphenylene oxides | 20 | 1983 | |
| 4,842,946 Method for treating a polyimide surface to improve the adhesion of metal deposited thereon, and articles produced thereby | 27 | 1987 | |
| 4,959,121 Method for treating a polyimide surface for subsequent plating thereon | 16 | 1990 | |
|
|
|||
| 5,308,565 Method of preparing modified polyphenylene oxide resin systems for electrical laminates having improved solderability and solvent resistance | 11 | 1993 | |
| 5,397,822 Thermoplastic compositions containing polyphenylene ether resin and characterized by improved elongation and flexibility employing a blend of multiblock copolymers | 55 | 1993 | |
| 5,834,565 Curable polyphenylene ether-thermosetting resin composition and process | 56 | 1996 | |
| 6,387,990 Curable epoxy resin compositions with brominated triazine flame retardants | 9 | 1999 | |
| 6,576,718 Powder coating of thermosetting resin(s) and poly(phenylene ethers(s)) | 10 | 2000 | |
|
|
|||
| 4,496,695 Curable resin composition | 35 | 1982 | |
| 4,904,760 Thermosetting resin composition from cyanate ester and non-branched aromatic compound | 17 | 1988 | |
|
|
|||
| 6,518,362 Melt blending polyphenylene ether, polystyrene and curable epoxy | 12 | 1998 | |
|
|
|||
| 5,352,745 Curable polyphenylene ether and cyanurate resin composition and a cured resin composition obtainable therefrom | 57 | 1993 | |
|
|
|||
| 4,948,832 Reinforced thermoplastic molding materials based on polyphenylene ether | 19 | 1988 | |
|
|
|||
| 5,973,144 High char yield benzoxazines | 10 | 1997 | |
|
|
|||
| 4,571,341 Process for continuous rice cooking by steaming and apparatus therefor | 26 | 1984 | |
|
|
|||
| 5,557,843 Method of making a circuit board or layer thereof including semi-curing a second adhesive coated on a cured first adhesive | 14 | 1994 | |
|
|
|||
| 5,712,039 Epoxy adhesives with dithiooxamide adhesion promoters | 15 | 1995 | |
|
|
|||
| 4,853,423 Curable polyphenylene ether-polyepoxide compositions useful in printed circuit board production | 20 | 1988 | |
Patent Citation Ranking
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Feb 15, 2014 |
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Feb 15, 2018 |
| Fee | Large entity fee | small entity fee | micro entity fee |
|---|---|---|---|
| Surcharge - 7.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
| Surcharge - 11.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
| Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
| Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |