Poly(arylene ether) adhesive compositions
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United States of America Patent
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Aug 15, 2006
Grant Date -
Jul 21, 2005
app pub date -
Jan 7, 2005
filing date -
Jun 20, 2000
priority date (Note) -
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Abstract
A laminate, comprises a thermoplastic substrate, a conductive metal foil at least partially disposed on at least one side of the substrate, and an adhesive disposed between the substrate and the metal foil. The adhesive includes a blend of a poly(arylene ether), a thermosetting resin, a toughening agent, a plasticizer, and a cure agent. The laminate finds particular utility in circuit board applications.
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