Stacked package for electronic elements and packaging method thereof
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United States of America Patent
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Aug 15, 2006
Grant Date -
Dec 2, 2004
app pub date -
Feb 19, 2004
filing date -
May 27, 2003
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A stacked package for electronic elements is provided, a plurality of stud bumps are formed on a substrate by means of a stud bump process to align with a plurality of vias of one provided electronic element. The stud bumps respectively pass through the vias and electrically connect the electronic element. Furthermore, additional electronic elements are stacked on the carrier according to a similar way to form a stacked electronic package.
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