Circuit device and manufacturing method of circuit device and semiconductor module
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Aug 15, 2006
Issued Date -
N/A
app pub date -
Feb 24, 2003
filing date -
Jan 31, 2000
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
After a trench 54 is formed in a conductive foil 60, the circuit elements are mounted, and the insulating resin is applied on the conductive foil 60 as the support substrate. After being inverted, the conductive foil 60 is polished on the insulating resin 50 as the support substrate for separation into the conductive paths. Accordingly, it is possible to fabricate the circuit device in which the conductive paths 51 and the circuit elements 52 are supported by the insulating resin 50, without the use of the support substrate. And the interconnects L1 to L3 requisite for the circuit are formed, and can be prevented from slipping because of the curved structure 59 and a visor 58.
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