Methods for manufacturing resistors using a sacrificial layer
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United States of America Patent
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Aug 15, 2006
Issued Date -
N/A
app pub date -
Jun 30, 2004
filing date -
Apr 18, 1996
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Abstract
A microelectronic assembly, including a microelectronic element such as a semiconductor chip and a dielectric material covering the chip and forming a body having a bottom surface. The assembly includes conductive units having portions exposed at the bottom surface, posts extending upwardly from said exposed portions and top flanges spaced above the bottom surface.
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