High density interconnect
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United States of America Patent
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Aug 22, 2006
Grant Date -
N/A
app pub date -
Apr 30, 2004
filing date -
Apr 30, 2004
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An interconnect formed using a stiff layer having a plurality of holes extending there through. A first flexible layer is bonded to a first side of the stiff layer. The first flexible layer having a plurality of conductive bumps, each conductive bump being positioned over a hole. A second flexible layer is bonded to a second side of the stiff layer. The second flexible layer having a plurality of conductive bumps, each conductive bump being positioned over a hole. Signal paths are formed in the holes, the signal paths connecting the plurality of conductive bumps on the first layer to the plurality of conductive bumps on the second layer.
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