Electrodeposition coating method using lead-free cationic electrodeposition coating composition
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United States of America Patent
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Aug 22, 2006
Grant Date -
Feb 12, 2004
app pub date -
Mar 26, 2003
filing date -
Mar 26, 2002
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Abstract
With the use of a lead-free cationic electrodeposition coating composition containing a sulfonium-modified epoxy resin, an amine-modified novolak-type epoxy resin, and a blocked isocyanate curing agent as a binder resin, wherein the content of volatile organic components is 1% by weight or less, the coating liquid conductivity is 1000 to 2500 .mu.S/cm, and the minimum film-forming temperature of the coated layer electrodeposited on an object to be coated is 20 to 35.degree. C., electrodeposition coating is carried out at or above the temperature which is lower by 2.degree. C. than the minimum film-forming temperature and at or below the temperature which is higher by 6.degree. C. than the minimum film-forming temperature.
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