Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument
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United States of America Patent
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Aug 22, 2006
Issued Date -
N/A
app pub date -
Oct 1, 2004
filing date -
Mar 27, 1998
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
The semiconductor device comprises an insulating film in which penetrating holes are formed, a semiconductor chip having electrodes, a wiring pattern adhered by an adhesive over a region including penetrating holes on one side of the insulating film and electrically connected to the electrodes of the semiconductor chip, and external electrodes provided on the wiring pattern through the penetrating holes and projecting from the surface opposite to the surface of the substrate on which the wiring pattern is formed. Part of the adhesive is drawn in to be interposed between the penetrating holes and external electrodes.
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