Semiconductor package having light sensitive chips
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Aug 22, 2006
Grant Date -
Feb 17, 2005
app pub date -
Sep 24, 2004
filing date -
Feb 18, 1997
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A microelectronic package includes a light sensitive microelectronic element having a front face including one or more contacts and a rear surface, and conductive leads having first ends connected to the one or more contacts and second ends connected to one or more conductive pads adjacent the light sensitive microelectronic element. The package also includes an at least partially transparent encapsulant covering the light sensitive microelectronic element, the conductive leads and the one or more conductive pads, whereby the one or more conductive pads are exposed on a surface of the encapsulant.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully