Semiconductor device and method of making the same
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Aug 22, 2006
Grant Date -
Jul 25, 2002
app pub date -
Oct 19, 2001
filing date -
Oct 23, 2000
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A semiconductor device and a method of making a semiconductor device are provided, wherein the device includes a die-pad, a semiconductor chip and a sealing resin. The die-pad has a first surface and a second surface opposite to the first surface. The second surface includes an exposed portion and a retreated portion around the exposed portion. The semiconductor chip is mounted on the first surface of the die-pad. The sealing resin covers the die-pad and the semiconductor chip, exposes the exposed portion, and is held in contact with the retreated portion.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully