Integrated circuit package including miniature antenna

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 7095372
SERIAL NO

11040622

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The present invention relates to an integrated circuit package comprising at least one substrate, each substrate including at least one layer, at least one semiconductor die, at least one terminal, and an antenna located in the integrated circuit package, but not on said at least one semiconductor die. The conducting pattern comprises a curve having at least five sections or segments, at least three of the sections or segments being shorter than one-tenth of the longest free-space operating wavelength of the antenna, each of the five sections or segments forming a pair of angles with each adjacent segment or section, wherein the smaller angle of each of the four pairs of angles between sections or segments is less than 180.degree. (i.e., no pair of sections or segments define a longer straight segment), wherein at least two of the angles are less than 115.degree., wherein at least two of the angles are not equal, and wherein the curve fits inside a rectangular area the longest edge of which is shorter than one-fifth of the longest free-space operating wavelength of the antenna.

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Patent Owner(s)

Patent OwnerAddress
FRACTUS S AST GARET DEL BAYE J OF SPAIN SANT CUGAT DEL VALLES BARCELONA

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Anguera, Pros Jaume Vinaros, ES 119 1207
Borja, Borau Carmen Barcelona, ES 32 637
Puente, Baliarda Carles Barcelona, ES 147 1862
Soler, Castany Jordi Mataro, ES 57 1145

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