Pressure sensor containing fluorine-based adhesive
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United States of America Patent
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Aug 29, 2006
Grant Date -
Sep 16, 2004
app pub date -
Dec 16, 2003
filing date -
Dec 16, 2002
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A pressure sensor is provided with a semiconductor device that is capable of detecting a pressure, a terminal that is connected to the semiconductor device by a bonding wire, a housing having an accommodation space for the semiconductor device, the bonding wire, and the terminal, a diaphragm for sealing the accommodation space, and working fluid that is sealed in the accommodation space and transmits a pressure applied to the diaphragm to the semiconductor device. The working fluid is silicone-based oil, and the terminal and the housing are sealed by fluorine-based adhesive.
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