Separator plate for manufacturing printed circuit board components
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Aug 29, 2006
Grant Date -
Aug 5, 2004
app pub date -
Jul 25, 2003
filing date -
Dec 27, 2002
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A separator plate for the production of printed circuit board components by pressing individual layers, which separator plate includes a metallic core layer and a coating on at least one side of the core layer, wherein the coating on the core layer, which is made of a comparatively well heat-conductive metal, is comprised of an outer metal layer applied to the core layer by cold-plating and made of a metal having a comparatively high surface hardness.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully