Positive type photosensitive epoxy resin composition and printed circuit board using the same
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United States of America Patent
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Aug 29, 2006
Issued Date -
N/A
app pub date -
Nov 6, 2001
filing date -
Nov 15, 2000
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A positive type, photosensitive epoxy resin composition comprising (a) an epoxy resin having two or more epoxy groups in one molecule, (b) a modified phenolic resin having a triazine ring, (c) a latent basic curing agent and (d) a photosensitive acid generator; and a preferably multilayered printed circuit board of buildup mode using said composition as an insulating layer.
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