Microelectronic assemblies having low profile connections
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Aug 29, 2006
Grant Date -
Nov 4, 2004
app pub date -
Oct 31, 2003
filing date -
Nov 13, 2002
priority date (Note) -
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status (Latency Note)
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Abstract
A method is disclosed for making a microelectronic package. A material is applied to a first major surface of a microelectronic element to reduce the heights of protrusions projecting from the first major surface. The microelectronic element is assembled to a microelectronic component. A method of forming protrusions and an assembly incorporating the microelectronic element having protrusions is also disclosed.
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