Testing circuits on substrates
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United States of America Patent
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Aug 29, 2006
Issued Date -
N/A
app pub date -
Jun 17, 2004
filing date -
Oct 22, 2001
priority date (Note) -
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status (Latency Note)
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Abstract
The invention provides a method of testing a circuit on a substrate. Generally speaking, a substrate is located in a transfer chuck, a surface of a test chuck is moved into contact with a substrate, the substrate is secured to the test chuck, the test chuck is moved relative to the transfer chuck so that the substrate moves off the transfer chuck, terminals on the substrate are moved into contact with contacts to electrically connect the circuit through the terminals and the contacts to an electric tester, signals are relayed through the terminal and the contacts between the electric tester and the circuit, the terminals are disengaged from the contacts, and the substrate is removed from the test chuck.
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