Methods of forming printed circuit boards having embedded thick film capacitors
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United States of America Patent
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Sep 5, 2006
Grant Date -
Jan 5, 2006
app pub date -
Jul 1, 2004
filing date -
Jul 1, 2004
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Abstract
A method of forming printed wiring boards having embedded thick-film capacitors includes covering capacitor layers with a protective coating prior to etching to prevent etching solutions from contacting with and damaging the capacitor layers and forming vias directly between the capacitor electrodes and the board circuitry.
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