Apparatus and method having mechanical isolation arrangement for controlling the temperature of an electronic device under test
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Sep 5, 2006
Grant Date -
N/A
app pub date -
Jul 16, 2002
filing date -
Jul 16, 2002
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An apparatus and method for controlling the temperature of an electronic device under test utilizes a thermal head spaced apart from a movable support structure by a mechanical isolation assembly. The support structure has a manifold configured to route refrigerant fluid between the evaporator head and components of a refrigeration system. The mechanical isolation assembly is configured to compensate for variations in the planar orientation of the device under test. Moreover, the mechanical isolation assembly preferably includes bellows through which the refrigerant fluid is conducted.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully