Chip holding arrangement, pad printing system incorporating the arrangement, and method of pad printing a chip using the arrangement
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United States of America Patent
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Sep 5, 2006
Issued Date -
N/A
app pub date -
Jun 4, 2002
filing date -
Jun 6, 2001
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Holding arrangement for a chip which includes a support having a first end for supporting the chip. A vacuum chamber is arranged in the support. An annular seal is arranged at the first end. A vacuum source evacuates the chamber. A method of holding a chip in the holding arrangement includes placing the chip into the holding arrangement, pad printing the chip, and removing the chip from the holding arrangement.
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