Method of manufacturing a semiconductor device having adjoining substrates
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United States of America Patent
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Sep 5, 2006
Issued Date -
N/A
app pub date -
Mar 20, 2003
filing date -
Mar 28, 2002
priority date (Note) -
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Abstract
The present invention aims to manufacture a large size semiconductor device with the inter-substrate transcription technology of thin film circuits. Enlargement is enabled by disposing a plurality of second substrates (21) in a tile shape. As the second substrate (21), a print substrate or flexible print circuit having double-sided wiring or multilayer wiring is employed. The plurality of second substrates (21) is driven independently, and the plurality of second substrates (21) is made to mutually overlap, and a drive circuit (23) is disposed at such overlapping portion. Moreover, the plurality of second substrates (21) is made to mutually overlap, and the mutual circuits are connected at such overlapping portion.
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