US Patent No: 7,101,793

Number of patents in Portfolio can not be more than 2000

Power module and its manufacturing method

ALSO PUBLISHED AS: 20060139857

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Abstract

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A method of manufacturing a power module is implemented which allows easy electrical connections between a control board and relay terminals. The diameter of through holes in the control board tapers down from a side of penetration of the relay terminals in a direction of the penetration, and respective one ends of the relay terminals have a smaller diameter than the other portions of the relay terminals. The diameter of the through holes on the side of penetration of the relay terminals is made sufficiently greater than the diameter of the one ends of the relay terminals, so that the relay terminals can easily penetrate the through holes. Further, even if the relay terminals are formed in deviated positions, the one ends of the relay terminals can be guided along the walls of the through holes in the penetration, so that the relay terminals can be adjusted to proper positions.

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Patent Owner(s)

Patent OwnerAddressTotal Patents
MITSUBISHI DENKI KABUSHIKI KAISHATOKYO19957

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Tsuji, Natsuki Hiroshima, JP 5 7

Cited Art Landscape

Patent Info (Count) # Cites Year
 
FormFactor, Inc. (1)
6,110,823 Method of modifying the thickness of a plating on a member by creating a temperature gradient on the member, applications for employing such a method, and structures resulting from such a method 181 1998
 
FUJITSU LIMITED (1)
6,390,831 Shelf-type telecommunications device including main and sub back wired boards connected by relay connectors 6 1999
 
OSRAM SYLVANIA INC. (1)
5,315,280 Bobbin for electrical windings 9 1991
 
TOPPAN PRINTING CO., LTD. (1)
6,378,774 IC module and smart card 154 2000
 
YAZAKI CORPORATION (1)
2001/0000,498 Circuit member connection structure 5 2000

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