Method and apparatus for depositing refractory metal layers employing sequential deposition techniques to form a nucleation layer
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United States of America Patent
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Sep 5, 2006
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N/A
app pub date -
Oct 3, 2000
filing date -
Jun 28, 2000
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Abstract
A method and system to form a refractory metal layer on a substrate features nucleating a substrate using sequential deposition techniques in which the substrate is serially exposed to first and second reactive gases followed by forming a layer, employing vapor deposition, to subject the nucleation layer to a bulk deposition of a compound contained in one of the first and second reactive gases.
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