Leadframe-based housing, leadframe strip, surface-mounted optoelectronic-component, and production method
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United States of America Patent
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Sep 5, 2006
Grant Date -
Jul 20, 2006
app pub date -
Sep 5, 2003
filing date -
Sep 17, 2002
priority date (Note) -
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Abstract
A leadframe-based housing for a surface-mountable component, particularly a radiation-emitting component. The leadframe-based housing comprises electrical connector strips and at least one chip mounting area. One of the connector strips includes an injection aperture that enables a leadframe-based housing to be produced with a very small thickness in an injection molding process. A method for producing such housings is further specified.
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