Semiconductor package and leadframe with horizontal leads spaced in the vertical direction and method of making
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Sep 5, 2006
Issued Date -
N/A
app pub date -
Aug 17, 2001
filing date -
Aug 17, 2001
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A leadframe, a semiconductor package, and methods of making the same are disclosed. A leadframe includes leads having an inner end segment. A first subset of the leads include a recess in a first surface of the inner end segment. A second subset of the leads include a recess in an opposite second surface of the inner end segment. The first subset leads are in an alternating lateral pattern with the second subset leads such that the recess of adjacent inner end segments are oriented in opposite directions. The recesses separate adjacent inner end segments in a vertical direction, thereby eliminating or reducing a need for horizontal spacing between adjacent inner end segments. In a semiconductor package, a semiconductor chip is electrically connected by a bond wire to the inner end segment of the leads. The bond wire is bonded within the recess of alternating leads.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully