Arrangements of differential pairs in multi-layer printed circuit board for eliminating crosstalk
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United States of America Patent
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Sep 5, 2006
Issued Date -
N/A
app pub date -
Feb 19, 2004
filing date -
Nov 11, 2003
priority date (Note) -
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Abstract
An arrangement of differential pairs in a multi-layer printed circuit board is provided for eliminating crosstalk. The arrangement of differential pairs in the multi-layer printed circuit board includes a first differential pair, and a second differential pair. The first differential pair and the second differential pair may each be a driven pair or a victim pair. By properly arranging the first differential pair and the second differential pair, in accordance with the present invention, the resultant crosstalk on the first differential pair induced by the second differential pair, or vice versa, is substantially zero or negligible.
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