US Patent No: 7,102,763

Number of patents in Portfolio can not be more than 2000

Methods and apparatus for processing microelectronic workpieces using metrology

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ALSO PUBLISHED AS: 20030020928
ATTORNEY / AGENT: (SPONSORED)
 

Importance

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Abstract

A method and apparatus for processing a microelectronic workpiece using metrology. The apparatus can include one or more processing or transport units, a metrology unit, and a control unit coupled to the metrology unit and at least one of the processing or transport units. The control unit can modify a process recipe or a process sequence of the processing unit based on a feed forward or a feed back signal from the metrology unit. The control unit can also provide instructions to the transport unit to move the workpiece to a selected processing unit. The processing unit can include, inter alia, a seed layer deposition unit, a process layer electrochemical deposition unit, a seed layer enhancement unit, a chemical mechanical polishing unit, and/or an annealing chamber arranged for sequential processing of a workpiece. The processing units can be controlled as an integrated system using one or more metrology units, or a separate metrology unit can provide input to the processing units.

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First Claim

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Patent Owner(s)

Patent OwnerAddressTotal Patents
APPLIED MATERIALS, INC.SANTA CLARA, CA6777

International Classification(s)

  • [Classification Symbol]
  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Aegerter, Brian Kalispell, MT 17 87
Dundas, Curt Kalispell, MT 5 41
Eudy, Steve L Bigfork, MT 16 117
McHugh, Paul R Kalispell, MT 82 463
Peace, Steven L Whitefish, MT 41 280
Ritzdorf, Thomas L Big Fork, MT 65 525
Weaver, Robert A Whitefish, MT 32 318
Wilson, Gregory J Kalispell, MT 90 528

Cited Art

Patent Info (Count) # Cites Year
 
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Patent Citation Ranking

Forward Cites

Patent Info (Count) # Cites Year
 
ASM JAPAN K.K. (1)
7,340,320 Method of recipe control operation 1 2005
 
GLOBALFOUNDRIES INC. (1)
7,296,103 Method and system for dynamically selecting wafer lots for metrology processing 4 2004
 
INTERNATIONAL BUSINESS MACHINES CORPORATION (1)
7,833,907 CMP methods avoiding edge erosion and related wafer 0 2008
 
SEMITOOL, INC. (1)
7,566,386 System for electrochemically processing a workpiece 0 2004
 
TOKYO ELECTRON LIMITED (1)
8,197,996 Dual tone development processes 0 2009
 
ULTRATECH, INC. (1)
7,731,798 Heated chuck for laser thermal processing 0 2004

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