Scalable 2-stage interconnections
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Sep 5, 2006
Grant Date -
Jun 19, 2003
app pub date -
Feb 23, 2002
filing date -
Jun 15, 2001
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
Modifications to the 2-stage interconnection to allow flexible scalability. Different switching fabrics having a range of different sizes can be constructed out of the same set of I/O switching nodes through this modified 2-statge interconnection, which can further be recursively invoked to construct large switching fabrics with desirable sizes. The recursive construction incorporating the modified 2-stage interconnection can seamlessly be realized through the five hierarchical levels of physical implementation, including inside-chip implementation, PCB implementation, orthogonal packaging, interface-board packaging and fiber-array packaging. The routability of the resulting switching fabric is always guaranteed and self-routing mechanism is also pertained.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully