Method for providing a backing member for an acoustic transducer array

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United States of America Patent

PATENT NO 7103960
SERIAL NO

10273996

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Abstract

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A method is provided for making a backing layer for an ultrasonic matrix array transducer useful in medical imaging and the like. A conductive grid is provided which includes a plurality of micro-contacts each joined together by a common base so that spaces are provided between the free ends of the contacts. A mold for the grid is filled with an acoustically absorbent material such that the absorbent material fills the spaces between the contacts, so as to produce a block when cured. The common base is removed so as to separate the contacts from one another within the block. Further machining exposes the opposite ends of micro-contacts so that a like number of contact faces or pads are provided at opposed surfaces of the backing layer. Improved transducer constructions are also disclosed.

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Patent Owner(s)

Patent OwnerAddress
VERMON37000 TOURS

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Aime, Flesch Andresy, FR 2 51

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