Heterojunction tunneling diodes and process for fabricating same

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United States of America Patent

PATENT NO 7105866
SERIAL NO

10911624

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Abstract

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High quality epitaxial layers of compound semiconductor materials can be grown overlying large silicon wafers by first growing an accommodating buffer layer on a silicon wafer. The accommodating buffer layer is a layer of monocrystalline oxide spaced apart from the silicon wafer by an amorphous interface layer of silicon oxide. The amorphous interface layer dissipates strain and permits the growth of a high quality monocrystalline oxide accommodating buffer layer. Any lattice mismatch between the accommodating buffer layer and the underlying silicon substrate is taken care of by the amorphous interface layer.

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Patent Owner(s)

Patent OwnerAddress
SHENZHEN XINGUODU TECHNOLOGY CO LTD17TH FLOOR JINSONG MANSION TERRA INDUSTRIAL & TRADE PARK FUTIAN SHENZHEN

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Droopad, Ravindranath Chandler, AZ 76 2248
Eisenbeiser, Kurt Tempe, AZ 22 500
El-Zein, Nada Phoenix, AZ 10 329
Ramdani, Jamal Gilbert, AZ 131 3582

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