Method of chemical mechanical polishing using abrasive particles of alkaline earth metal salts
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United States of America Patent
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Sep 19, 2006
Grant Date -
Mar 3, 2005
app pub date -
Jun 18, 2004
filing date -
Dec 21, 2001
priority date (Note) -
Expired
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Abstract
Particles of strontium carbonate, barium carbonate, strontium sulfate and/or barium sulfate having a sufficient degree of fineness, especially when produced synthetically, are suitable as abrasive agents in chemical mechanical polishing (CMP polishing) of components, e.g., microelectronic components such as silicon wafers. The alkaline earth metal salt compounds are used as slurries in water and/or organic liquids and optionally may contain a dispersing agent, and preferably have a pH value of at least 8.
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