Methods for providing support for conductive structures protruding from semiconductor device components
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United States of America Patent
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-
Sep 19, 2006
Issued Date -
N/A
app pub date -
Apr 14, 2003
filing date -
Jun 8, 2000
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Methods of fabricating and disposing supports around contact pads of semiconductor device components and other substrates include use of stereolithographic techniques. The supports may be preformed structures which are attached to a surface of a semiconductor device component or other substrate. Alternatively, the supports may be fabricated on the surface of the semiconductor device or other substrate. One or more of the supports may be positioned around the contact pads of a semiconductor device component or other substrate before or after solder balls are secured to the contact pads. Upon reflowing the solder balls to connect the semiconductor device face-down to a higher level substrate, the supports prevent the reflowed solder from contacting regions of the surface of the semiconductor device that surround the contact pads thereof.
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