Algorithm for real-time process control of electro-polishing

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United States of America Patent

PATENT NO 7112270
APP PUB NO 20060163074A1
SERIAL NO

10456851

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Abstract

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Method and apparatus for process control of electro-processes. The method includes electro-processing a wafer by the application of two or more biases and determining an amount of charge removed as a result of each bias, separately. In one embodiment, an endpoint is determined for each bias when the amount of charge removed for a bias substantially equals a respective target charge calculated for the bias.

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Patent Owner(s)

Patent OwnerAddress
APPLIED MATERIALS INC3050 BOWERS AVENUE SANTA CLARA CA 95054

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Liang-Yuh Foster City, CA 187 3064
Duboust, Alain Sunnyvale, CA 84 1176
Manens, Antoine P Palo Alto, CA 64 779
Neo, Siew S Santa Clara, CA 15 317

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