US Patent No: 7,112,471

Number of patents in Portfolio can not be more than 2000

Leadless packaging for image sensor devices and methods of assembly

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A leadless image sensor package and methods for its assembly. In a first embodiment, an image sensor chip is mounted within a bottom-side cavity of a package shell in a flip-chip manner such that sensing circuitry on the image sensor chip is exposed through an aperture in the top side of the package shell. A transparent encapsulant material is deposited within the aperture to encase interconnect bonds between the package shell and the image sensor chip. A transparent lid is held in place over the aperture by the encapsulant material. The back surface of the image sensor chip is left exposed. In a second embodiment particularly suitable for high-end image sensors, an encapsulant material is not required. Instead, a backing cap is hermetically sealed to a ledge surface in the package shell to cover the bottom-side cavity. A compression member formed on the backing cap contacts the image sensor chip and maintains interconnect bond integrity.

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First Claim

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Patent Owner(s)

Patent OwnerAddressTotal Patents
MICRON TECHNOLOGY, INC.BOISE, ID20763

International Classification(s)

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  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Boon, Suan Jeung Singapore, SG 77 516
Chia, Yong Poo Singapore, SG 69 454
Chua, Swee Kwang Singapore, SG 48 356
Low, Siu Waf Singapore, SG 46 676
Neo, Yong Loo Singapore, SG 37 230

Cited Art Landscape

Patent Info (Count) # Cites Year
 
AMKOR TECHNOLOGY, INC. (3)
5,867,368 Mounting for a semiconductor integrated circuit device 83 1997
6,686,588 Optical module with lens integral holder 105 2001
6,455,927 Micromirror device package 59 2001
 
3M INNOVATIVE PROPERTIES COMPANY (1)
2002/0089,044 Hermetic mems package with interlocking layers 49 2001
 
AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD. (1)
6,351,027 Chip-mounted enclosure 89 2000
 
FUJITSU SEMICONDUCTOR LIMITED (1)
6,798,031 Semiconductor device and method for making the same 19 2002
 
HAMAMATSU PHOTONICS K.K. (1)
6,703,598 Semiconductor photo-detecting apparatus 6 2002
 
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. (1)
6,404,648 Assembly and method for constructing a multi-die integrated circuit 47 2001
 
KULICKE AND SOFFA INDUSTRIES, INC. (1)
2003/0197,285 High density substrate for the packaging of integrated circuits 32 2002
 
MICRON TECHNOLOGY, INC. (1)
2004/0038,442 Optically interactive device packages and methods of assembly 105 2002
 
MITSUBISHI DENKI KABUSHIKI KAISHA (1)
5,477,081 Semiconductor device package 16 1992
 
MITSUBISHI MATERIALS CORPORATION (1)
5,675,474 Highly heat-radiating ceramic package 33 1995
 
OMNIVISION TECHNOLOGIES, INC. (1)
5,865,935 Method of packaging image sensors 26 1997
 
OVID DATA CO. LLC (1)
5,702,985 Hermetically sealed ceramic integrated circuit heat dissipating package fabrication method 24 1994
 
ROCKWELL TECHNOLOGIES, LLC (1)
6,433,332 Protective encapsulation for a phototransducer including a surfactant film 3 2000
 
ROUND ROCK RESEARCH, LLC (1)
6,885,107 Flip-chip image sensor packages and methods of fabrication 129 2002
 
RYO HOLDINGS, LLC (1)
5,699,073 Integrated electro-optical package with carrier ring and method of fabrication 31 1996
 
SAMSUNG ELECTRONICS CO., LTD. (1)
6,861,737 Semiconductor device packages having semiconductor chips attached to circuit boards, and stack packages using the same 19 1997
 
SANDIA CORPORATION (1)
6,384,473 Microelectronic device package with an integral window 103 2000
 
SANDIA NATIONAL LABORATORIES (1)
6,531,341 Method of fabricating a microelectronic device package with an integral window 28 2000
 
SCIENTEK CORP. (1)
6,649,991 Image sensor semiconductor package 25 2002
 
SEONG CAPITAL LTD. LIMITED LIABILITY COMPANY (1)
5,687,474 Method of assembling and cooling a package structure with accessible chip 14 1996
 
Silicon Film Technologies, Inc. (1)
6,147,389 Image sensor package with image plane reference 57 1999
 
SPORTRACK LLC. (1)
5,357,056 Chip carrier for optical device 34 1993
 
STMICROELECTRONICS S.A. (1)
6,713,876 Optical semiconductor housing and method for making same 4 2002

Patent Citation Ranking

Forward Cite Landscape

Patent Info (Count) # Cites Year
 
MICRON TECHNOLOGY, INC. (12)
7,547,978 Underfill and encapsulation of semiconductor assemblies with materials having differing properties 3 2004
7,250,663 Frame scale package using contact lines through the elements 3 2005
7,521,296 Methods of fabricating a microlens including selectively curing flowable, uncured optically trasmissive material 0 2006
7,488,618 Microlenses including a plurality of mutually adhered layers of optically transmissive material and systems including the same 3 2006
7,442,643 Methods of forming conductive elements using organometallic layers and flowable, curable conductive materials 1 2006
7,700,406 Methods of assembling integrated circuit packages 1 2007
7,993,977 Method of forming molded standoff structures on integrated circuit devices 0 2007
7,923,298 Imager die package and methods of packaging an imager die on a temporary carrier 1 2007
8,072,082 Pre-encapsulated cavity interposer 2 2008
7,977,157 Methods of forming integrated circuit packages, and methods of assembling integrated circuit packages 1 2010
8,531,031 Integrated circuit packages 0 2011
8,399,297 Methods of forming and assembling pre-encapsulated assemblies and of forming associated semiconductor device packages 0 2011
 
RENESAS ELECTRONICS CORPORATION (2)
7,220,607 Method of manufacturing a semiconductor device 3 2005
7,732,910 Lead frame including suspending leads having trenches formed therein 1 2007
 
APTINA IMAGING CORPORATION (1)
7,659,134 Microelectronic imagers and methods for manufacturing such microelectronic imagers 0 2007
 
SEIKO EPSON CORPORATION (1)
7,419,840 Semiconductor device, method of manufacturing the same, cover for semiconductor device, and electronic equipment 3 2005

Maintenance Fees

Fee Large entity fee small entity fee micro entity fee due date
7.5 Year Payment $3600.00 $1800.00 $900.00 Mar 26, 2014
11.5 Year Payment $7400.00 $3700.00 $1850.00 Mar 26, 2018
Fee Large entity fee small entity fee micro entity fee
Surcharge - 7.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge - 11.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge after expiration - Late payment is unavoidable $700.00 $350.00 $175.00
Surcharge after expiration - Late payment is unintentional $1,640.00 $820.00 $410.00