Leadless packaging for image sensor devices and methods of assembly

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 7112471
APP PUB NO 20040084741A1
SERIAL NO

10693376

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A leadless image sensor package and methods for its assembly. In a first embodiment, an image sensor chip is mounted within a bottom-side cavity of a package shell in a flip-chip manner such that sensing circuitry on the image sensor chip is exposed through an aperture in the top side of the package shell. A transparent encapsulant material is deposited within the aperture to encase interconnect bonds between the package shell and the image sensor chip. A transparent lid is held in place over the aperture by the encapsulant material. The back surface of the image sensor chip is left exposed. In a second embodiment particularly suitable for high-end image sensors, an encapsulant material is not required. Instead, a backing cap is hermetically sealed to a ledge surface in the package shell to cover the bottom-side cavity. A compression member formed on the backing cap contacts the image sensor chip and maintains interconnect bond integrity.

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First Claim

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Patent Owner(s)

Patent OwnerAddressTotal Patents
MICRON TECHNOLOGY, INC.BOISE, ID19078

International Classification(s)

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  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Boon, Suan Jeung Singapore, SG 53 943
Chia, Yong Poo Singapore, SG 52 822
Chua, Swee Kwang Singapore, SG 29 553
Low, Siu Waf Singapore, SG 30 931
Neo, Yong Loo Singapore, SG 23 407

Cited Art Landscape

Patent Info (Count) # Cites Year
 
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3M INNOVATIVE PROPERTIES COMPANY (1)
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HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. (1)
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MICRON TECHNOLOGY, INC. (1)
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OVID DATA CO. LLC (1)
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SAMSUNG ELECTRONICS CO., LTD. (1)
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ROCKWELL TECHNOLOGIES, LLC (1)
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RYO HOLDINGS, LLC (1)
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KULICKE AND SOFFA INDUSTRIES, INC. (1)
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ROUND ROCK RESEARCH, LLC (1)
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SANDIA NATIONAL LABORATORIES (1)
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OMNIVISION TECHNOLOGIES, INC. (1)
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AMKOR TECHNOLOGY, INC. (3)
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Sandia Corporation (1)
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MITSUBISHI MATERIALS CORPORATION (1)
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STMICROELECTRONICS S.A. (1)
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SCIENTEK CORP. (1)
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* Cited By Examiner

Patent Citation Ranking

Forward Cite Landscape

Patent Info (Count) # Cites Year
 
SEIKO EPSON CORPORATION (2)
* 7419840 Semiconductor device, method of manufacturing the same, cover for semiconductor device, and electronic equipment 8 2005
* 2005/0255,627 Semiconductor device, method of manufacturing the same, cover for semiconductor device, and electronic equipment 2 2005
 
U.S. BANK NATIONAL ASSOCIATION (1)
* 2005/0285,265 Frame scale package using contact lines through the elements 1 2005
 
MICRON TECHNOLOGY, INC. (14)
7547978 Underfill and encapsulation of semiconductor assemblies with materials having differing properties 4 2004
* 7250663 Frame scale package using contact lines through the elements 4 2005
7521296 Methods of fabricating a microlens including selectively curing flowable, uncured optically trasmissive material 1 2006
7488618 Microlenses including a plurality of mutually adhered layers of optically transmissive material and systems including the same 3 2006
7442643 Methods of forming conductive elements using organometallic layers and flowable, curable conductive materials 1 2006
7700406 Methods of assembling integrated circuit packages 1 2007
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7923298 Imager die package and methods of packaging an imager die on a temporary carrier 2 2007
* 8072082 Pre-encapsulated cavity interposer 11 2008
7977157 Methods of forming integrated circuit packages, and methods of assembling integrated circuit packages 1 2010
8531031 Integrated circuit packages 0 2011
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* 2012/0034,740 PRE-ENCAPSULATED CAVITY INTERPOSER 1 2011
8709866 Methods of forming integrated circuit packages 0 2013
 
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC (2)
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RENESAS ELECTRONICS CORPORATION (3)
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* 2005/0245,002 Method of manufacturing a semiconductor device and used for the same 0 2005
7732910 Lead frame including suspending leads having trenches formed therein 1 2007
* Cited By Examiner

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