Method of making a semiconductor chip assembly with a bumped metal pillar
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United States of America Patent
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Sep 26, 2006
Grant Date -
N/A
app pub date -
Nov 27, 2004
filing date -
Oct 13, 2000
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method of making a semiconductor chip assembly includes providing a metal base, a routing line and a bumped terminal, then mechanically attaching a semiconductor chip to the metal base, the routing line and the bumped terminal, then forming an encapsulant, and then etching the metal base to form a metal pillar that contacts the bumped terminal.
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