Method of producing of circuit board; for semiconductor device
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United States of America Patent
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Oct 3, 2006
Grant Date -
Nov 21, 2002
app pub date -
May 15, 2002
filing date -
May 21, 2001
priority date (Note) -
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Abstract
A method of production of a circuit board able to prevent peeling of a conductive layer during polishing of the conductive layer including the steps of forming at least holes in one surface of a substrate; forming a plating power supply layer on the one surface of the substrate, the other surface, the sides, and inner surfaces of the holes; forming a metal layer formed on the one surface of the substrate, the other surface, and the sides and burying the holes by electroplating through the plating power supply layer; and polishing the metal layer to form interconnect patterns comprised of the metal layer buried in the holes.
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