Metal/ceramic bonding substrate and method for producing same
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United States of America Patent
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Oct 17, 2006
Grant Date -
Apr 21, 2005
app pub date -
Oct 19, 2004
filing date -
Oct 21, 2003
priority date (Note) -
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Abstract
There is provided a metal/ceramic bonding substrate having improved reliability to heat cycles, and a method for producing the same. In a metal/ceramic bonding substrate 10 wherein a circuit forming metal plate 14 is bonded to one side of a ceramic substrate 12 and a radiating metal base plate 16 is bonded to the other side thereof, at least part of the ceramic substrate 12 is embedded in the metal base plate 16. The ceramic substrate 12 is arranged substantially in parallel to the metal base member 16.
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