Polyamide-imide resin solution and the use thereof for producing wire enamels
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Oct 17, 2006
Grant Date -
Jan 8, 2004
app pub date -
Aug 27, 2001
filing date -
Aug 25, 2000
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
The present invention relates to a polyamideimide resin solution preparable by reacting (a) aromatic polycarboxylic acids and/or their anhydrides with (b) aromatic imide- and amide-forming components in cresol at temperatures above 170.degree. C., to the use of this polyamideimide solution for the preparation of wire enamels, to the wire enamels in question, and to the enamelled wires coated therewith.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully