Method of fabricating an interconnection for chip sandwich arrangements
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United States of America Patent
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Oct 17, 2006
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app pub date -
Sep 17, 2004
filing date -
Sep 17, 2003
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Abstract
The invention relates to an interconnection for chip sandwich structures by means of which chips can be electrically and mechanically connected to one another face-to-face, and to a method for the production thereof. The invention is intended to create interconnections that can be produced more cost-effectively and more effectively. This is achieved by virtue of the fact that pin- or sleeve-shaped contact elements (3) are arranged between the chips (1, 2), which contact elements create an electrical and mechanical interconnection between the contact pads (4, 5) of the semiconductor chips (1, 2) and are soldered to the latter.
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