Electronic package having a sealing structure on predetermined area, and the method thereof
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United States of America Patent
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-
Oct 17, 2006
Grant Date -
Oct 13, 2005
app pub date -
Sep 10, 2004
filing date -
Apr 12, 2004
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An electronic package for a photo-sensing device is provided. The package is formed to include a substrate of a material substantially transparent to light within a predetermined range of wavelengths. The package further formed to include at least one photo-sensing die having a photo-sensing area defined on a front side thereof. The photo-sensing die is mounted to the substrate by a plurality of interconnection joints disposed about the photo-sensing area, whereby the front side of the photo-sensing die is spaced by a gap from a front surface of the substrate. A sealing structure is formed to extend about the interconnection joints to fill portions of the gap thereabout, such that the sealing structure contiguously encloses an internal cavity in substantially sealed manner between the photo-sensing die and substrate. This internal cavity communicates with the photo-sensing area of the photo-sensing die.
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